DocumentCode
2338143
Title
Thermal comfort sensor
Author
Kon, Akihiko
Author_Institution
Solid State Adv. Center, Yamatake-Honeywell Co., Japan
fYear
1994
fDate
10-12 May 1994
Firstpage
454
Abstract
Building Systems Division of Yamatake-Honeywell Co., has developed a new TY4700 Comfort Sensor that revolutionizes indoor comfort control. Thermal comfort depends on many factors-the new sensor´s output temperature signal is a combination of air temperature, radiant temperature and air velocity. The comfort sensor consists of a sensor unit and a processor unit. The sensor unit has a compact, light but accurate compound sensing element which detects air temperature, radiant temperature and air velocity. The processor unit uses the input data to provide an output signal representing the room´s thermal comfort/discomfort factor. Building automation (BA) systems can combine this output with humidity data and stored knowledge of tenant´s clothing and physical activity to calculate the ISO7730 standard Predicted Mean Vote (PMV) thermal comfort index, which ensures maximum comfort for tenants and minimum energy expenditure for building operators
Keywords
air conditioning; building management systems; detectors; electric sensing devices; heating; space heating; temperature control; temperature measurement; velocity measurement; ISO7730 standard Predicted Mean Vote; TY4700 Comfort Sensor; Yamatake-Honeywell Co.; air temperature; air velocity; building automation; building operators; clothing; humidity data; indoor comfort control; minimum energy expenditure; radiant temperature; stored knowledge; thermal comfort index; thermal comfort sensor; thermal comfort/discomfort factor; Control systems; Gas detectors; Humidity; Sensor systems; Signal processing; Storage automation; Temperature dependence; Temperature sensors; Thermal factors; Thermal sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Instrumentation and Measurement Technology Conference, 1994. IMTC/94. Conference Proceedings. 10th Anniversary. Advanced Technologies in I & M., 1994 IEEE
Conference_Location
Hamamatsu
Print_ISBN
0-7803-1880-3
Type
conf
DOI
10.1109/IMTC.1994.351922
Filename
351922
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