• DocumentCode
    2338648
  • Title

    The reliability of the integrated circuits in automotive industry

  • Author

    Ferrati, E.

  • fYear
    1993
  • fDate
    27-29 Oct 1993
  • Firstpage
    125
  • Lastpage
    126
  • Abstract
    To obtain the reliability targets in automotive products is difficult. The environment for automotive products is comparable to military application while their cost has to compare favorably with consumer electronics. Automotive devices have to withstand wide electrical transients, strong thermal and mechanical stresses. In fact the main causes of failure are in almost perfect correlation with the above mentioned stresses. The partnership with semiconductor suppliers has the objective not only to guarantee the correct value of device parameters but also to define, at the design stage, the packaging size and all the other parameters which have a direct impact on component reliability. It is important to be able to design the set of reliability tests to be used to simulate the actual stress which the component will undergo during its life
  • Keywords
    Automotive engineering; Consumer electronics; Costs; Defense industry; Electrical products industry; Electronic packaging thermal management; Integrated circuit reliability; Semiconductor device packaging; Semiconductor device reliability; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Defect and Fault Tolerance in VLSI Systems, 1993., The IEEE International Workshop on
  • Conference_Location
    Venice
  • ISSN
    1550-5774
  • Print_ISBN
    0-8186-3502-9
  • Type

    conf

  • DOI
    10.1109/DFTVS.1993.595730
  • Filename
    595730