DocumentCode
2338648
Title
The reliability of the integrated circuits in automotive industry
Author
Ferrati, E.
fYear
1993
fDate
27-29 Oct 1993
Firstpage
125
Lastpage
126
Abstract
To obtain the reliability targets in automotive products is difficult. The environment for automotive products is comparable to military application while their cost has to compare favorably with consumer electronics. Automotive devices have to withstand wide electrical transients, strong thermal and mechanical stresses. In fact the main causes of failure are in almost perfect correlation with the above mentioned stresses. The partnership with semiconductor suppliers has the objective not only to guarantee the correct value of device parameters but also to define, at the design stage, the packaging size and all the other parameters which have a direct impact on component reliability. It is important to be able to design the set of reliability tests to be used to simulate the actual stress which the component will undergo during its life
Keywords
Automotive engineering; Consumer electronics; Costs; Defense industry; Electrical products industry; Electronic packaging thermal management; Integrated circuit reliability; Semiconductor device packaging; Semiconductor device reliability; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Defect and Fault Tolerance in VLSI Systems, 1993., The IEEE International Workshop on
Conference_Location
Venice
ISSN
1550-5774
Print_ISBN
0-8186-3502-9
Type
conf
DOI
10.1109/DFTVS.1993.595730
Filename
595730
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