DocumentCode
2339285
Title
Closing the testing gap between CMOS and photonics
Author
Osseiran, Adam
Author_Institution
Nat. Networked TeleTest Facility, Edith Cowan Univ., Joondalup, WA
fYear
2008
fDate
18-20 June 2008
Firstpage
1
Lastpage
5
Abstract
High speed circuits and systems in their vast majority are still invariably based on CMOS technology for obvious cost and power efficiency reasons. Photonics science is gaining momentum in these high speed systems and is traditionally found in telecommunications but also in high performance computing and recently in standard computing systems with the main objective of alleviating the CPU to memory bottleneck. RF processing is producing another level of complexity in the new emerging variety of embedded mixed-signals circuits and systems where a signal changes its media types several times without leaving the package assembly. This new paradigm where RF, analogue, digital and optical signals are integrated in one component entails an ad-hoc testing and hierarchical fault modelling approaches that embrace the individual approaches of each of these signal types and amalgamate them into one optimised approach.
Keywords
CMOS integrated circuits; high-speed integrated circuits; integrated circuit testing; integrated optoelectronics; mixed analogue-digital integrated circuits; CMOS technology; RF processing; RF signals; ad-hoc testing; analogue signals; digital signals; embedded mixed-signals circuits; hierarchical fault modelling; high speed circuits; high speed systems; memory bottleneck; optical signals; package assembly; photonics science; testing gap; CMOS memory circuits; CMOS technology; Circuit testing; Circuits and systems; Costs; High performance computing; Photonics; RF signals; Radio frequency; Telecommunication standards;
fLanguage
English
Publisher
ieee
Conference_Titel
Mixed-Signals, Sensors, and Systems Test Workshop, 2008. IMS3TW 2008. IEEE 14th International
Conference_Location
Vancouver, BC
Print_ISBN
978-1-4244-2395-8
Electronic_ISBN
978-1-4244-2396-5
Type
conf
DOI
10.1109/IMS3TW.2008.4581602
Filename
4581602
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