DocumentCode :
2339423
Title :
Characterization and testing of microelectromechnical accelerometers
Author :
Dasnurkar, Sachin ; Abraham, Jacob
Author_Institution :
Comput. Eng. Res. Center, Univ. of Texas at Austin, Austin, TX
fYear :
2008
fDate :
18-20 June 2008
Firstpage :
1
Lastpage :
6
Abstract :
Analog and Mixed Signal circuits pose a greater challenge in semiconductor testing than digital circuits due to the complexity of test requirements and the extremely large test vector sample space [?]. MicroElectroMechanical Systems (MEMS) are an emerging field combining mechanical components with semiconductor circuitry on-chip. Conventional testing and characterization methods for MEMS are very resource intensive. Alternate Testing, or Indirect Testing is a methodology used to identify and implement economical, fast and less complex tests to replace conventional complex, specification based tests [?]. This paper describes a methodology to characterize and test the mechanical subsystem of an accelerometer using its electrical sub-system. We use a novel pseudo-mechanical impetus to obtain an analog output which is then used for parameter mapping to characterize both electrical and mechanical subsystems in a purely electrical test. Measurements on commercial accelerometers demonstrate that the results of electrical tests correlates well with those from mechanical tests, providing an accurate low-cost solution for high-volume manufacturing test of accelerometers.
Keywords :
accelerometers; micromechanical devices; semiconductor device testing; electrical subsystem; electrical test; high-volume manufacturing test; microelectromechnical accelerometers; pseudomechanical impetus; Accelerometers; Circuit testing; Digital circuits; Electric variables measurement; Manufacturing; Mechanical variables measurement; Microelectromechanical systems; Micromechanical devices; Semiconductor device testing; System-on-a-chip;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Mixed-Signals, Sensors, and Systems Test Workshop, 2008. IMS3TW 2008. IEEE 14th International
Conference_Location :
Vancouver, BC
Print_ISBN :
978-1-4244-2395-8
Electronic_ISBN :
978-1-4244-2396-5
Type :
conf
DOI :
10.1109/IMS3TW.2008.4581609
Filename :
4581609
Link To Document :
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