• DocumentCode
    2339503
  • Title

    ESD protection for mixed-signal circuits — design or test problem?

  • Author

    Lubana, S.S. ; Sarbishaei, Hossein ; Sachdev, Manoj

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Waterloo, Waterloo, ON
  • fYear
    2008
  • fDate
    18-20 June 2008
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    In spite of significant progress during last couple of decades, ESD still affects production yields, manufacturing costs, product quality, reliability and profitability. The objective of an ESD protection circuit is to create a harmless shunting path for the static electricity before it damages the sensitive electronic circuits. As the devices are continuously scaling down, while ESD energy remains the same, VLSIs become more vulnerable to ESD stress. This higher susceptibility to ESD damage is due to thinner gate oxides and shallower junctions. Furthermore, higher operating frequency of the scaled technologies enforces lower parasitic capacitance of the ESD protection circuits. As a result, increasing the robustness of the ESD protection circuits with minimum additional parasitic capacitance is the main challenge in state of the art CMOS processes. In this paper a general methodology to design ESD protection circuits and devices is discussed. This method is used to tackle some of the main challenges facing ESD designers in modern technologies.
  • Keywords
    CMOS integrated circuits; VLSI; electrostatic discharge; integrated circuit design; mixed analogue-digital integrated circuits; protection; CMOS processes; ESD; VLSI; electrostatic discharge; mixed-signal circuits; parasitic capacitance; protection circuits; CMOS technology; Circuit testing; Costs; Coupling circuits; Electrostatic discharge; Manufacturing; Parasitic capacitance; Production; Profitability; Protection;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Mixed-Signals, Sensors, and Systems Test Workshop, 2008. IMS3TW 2008. IEEE 14th International
  • Conference_Location
    Vancouver, BC
  • Print_ISBN
    978-1-4244-2395-8
  • Electronic_ISBN
    978-1-4244-2396-5
  • Type

    conf

  • DOI
    10.1109/IMS3TW.2008.4581613
  • Filename
    4581613