An ABCD Parameter Based Modeling and Analysis of Crosstalk Induced Effects in Multiwalled Carbon Nanotube Bundle Interconnects

Cross talk effects in large diameter Multiwalled Carbon Nanotube bundle interconnects (MWCNTs) for the future nanoscale integrated circuits are investigated with the help of ABCD parameter matrix approach for intermediate and global interconnects at 22 nm and 14 nm technology nodes. Here, isolated MWCNTs are modeled using an equivalent single conductor transmission line. Simulation results show that the proposed model matches very well with the SPICE model available in literatures. The worst case cross talk induced delay and peak cross talk noise voltages for MWCNT bundle interconnects are derived and compared to those of conventional copper interconnects. The worst case cross talk delays for MWCNT bundle interconnects are less than 15% of that of copper interconnects for 1 mm long intermediate and less than 20% of that of copper interconnects for 2 mm long global interconnects for both the technology nodes. The ratio of peak cross talk noise voltage of MWCNT bundles to that of Copper is seen to decrease in scaled technology. We have compared our cross talk analysis results with the earlier work to verify the validity of our proposed model and observed that the results with our model are in good agreement with the existing work. Finally, our analysis shows that from the signal integrity perspective, large diameter MWCNT bundles are a very good alternative to copper interconnects for future Integrated circuit technology generations.