• DocumentCode
    2339743
  • Title

    Recovery of Copper from Bio-leaching Solutions of Waste Printed Circuit Boards Waste by Ion Exchange

  • Author

    Chenglong, Zhang ; Yujia, Cai ; Jingwei, Wang ; Jianfeng, Bai ; Yuan, Zhou ; Wenjie, Wu ; Wenxiong, Mao

  • Author_Institution
    Sch. of Environ. Eng., Shanghai Second Polytech. Univ., Shanghai, China
  • Volume
    2
  • fYear
    2010
  • fDate
    18-20 Dec. 2010
  • Firstpage
    138
  • Lastpage
    140
  • Abstract
    According to the properties of bioleaching solutions of printed circuit boards (PCBs), copper in the leaching solution were recovery by ion exchange with macroporous styrene iminodiacetic acid chelating resin D401. The bed height of resin, flow rate, pH value on copper adsorption had been studied. Work Exchange Capacity (WEC) of copper increased with increasing bed height of resin and flow rate. The copper WEC of 7.88 mg/mL can be obtained with pH 2.5 and 200 mm bed height at flow rate of 2 mL/min. More than 99.5% of copper could be eluted from loaded resin to get the copper enriched solution by 1.0 M sulphuric acid at A/R ratio 20 in at flow rate of 2 mL/min. Results of the present investigation indicated that D401 resin can efficiently recovery copper from bioleaching solution of PCBs.
  • Keywords
    copper; electronics industry; ion exchange; leaching; printed circuits; resins; waste recovery; Cu; D401 chelating resin; bioleaching solutions; copper adsorption; copper recovery; ion exchange; macroporous styrene iminodiacetic acid; waste printed circuit boards; work exchange capacity; Bioleaching Copper; Ion exchange; Resin; Waste printed circuit boards;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Digital Manufacturing and Automation (ICDMA), 2010 International Conference on
  • Conference_Location
    ChangSha
  • Print_ISBN
    978-0-7695-4286-7
  • Type

    conf

  • DOI
    10.1109/ICDMA.2010.428
  • Filename
    5701368