DocumentCode
2339743
Title
Recovery of Copper from Bio-leaching Solutions of Waste Printed Circuit Boards Waste by Ion Exchange
Author
Chenglong, Zhang ; Yujia, Cai ; Jingwei, Wang ; Jianfeng, Bai ; Yuan, Zhou ; Wenjie, Wu ; Wenxiong, Mao
Author_Institution
Sch. of Environ. Eng., Shanghai Second Polytech. Univ., Shanghai, China
Volume
2
fYear
2010
fDate
18-20 Dec. 2010
Firstpage
138
Lastpage
140
Abstract
According to the properties of bioleaching solutions of printed circuit boards (PCBs), copper in the leaching solution were recovery by ion exchange with macroporous styrene iminodiacetic acid chelating resin D401. The bed height of resin, flow rate, pH value on copper adsorption had been studied. Work Exchange Capacity (WEC) of copper increased with increasing bed height of resin and flow rate. The copper WEC of 7.88 mg/mL can be obtained with pH 2.5 and 200 mm bed height at flow rate of 2 mL/min. More than 99.5% of copper could be eluted from loaded resin to get the copper enriched solution by 1.0 M sulphuric acid at A/R ratio 20 in at flow rate of 2 mL/min. Results of the present investigation indicated that D401 resin can efficiently recovery copper from bioleaching solution of PCBs.
Keywords
copper; electronics industry; ion exchange; leaching; printed circuits; resins; waste recovery; Cu; D401 chelating resin; bioleaching solutions; copper adsorption; copper recovery; ion exchange; macroporous styrene iminodiacetic acid; waste printed circuit boards; work exchange capacity; Bioleaching Copper; Ion exchange; Resin; Waste printed circuit boards;
fLanguage
English
Publisher
ieee
Conference_Titel
Digital Manufacturing and Automation (ICDMA), 2010 International Conference on
Conference_Location
ChangSha
Print_ISBN
978-0-7695-4286-7
Type
conf
DOI
10.1109/ICDMA.2010.428
Filename
5701368
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