• DocumentCode
    233992
  • Title

    Forward Body Biased Adiabatic Logic for Peak and Average Power Reduction in 22nm CMOS

  • Author

    Morrison, Matthew ; Ranganathan, Nagarajan

  • Author_Institution
    Dept. of Comput. Sci. & Eng., Univ. of South Florida, Tampa, FL, USA
  • fYear
    2014
  • fDate
    5-9 Jan. 2014
  • Firstpage
    470
  • Lastpage
    475
  • Abstract
    Quantum mechanical principles that govern the basic laws of physics increasingly limit CMOS operation with transistor scaling. Traditional logic based CMOS circuits cannot achieve ultra-low power levels due to heat dissipated for a single bit loss of information as represented by the Landauer barrier. Reversible logic is a promising computing paradigm towards realization of ultra-low power computing circuits. Reducing average and peak power consumption is an effective strategy for mitigation of side-channel attacks, such as Differential Power Analysis. We present designs of Forward Body Biased Adiabatic Logic for reduction of average, peak, and differential power. HSPICE simulations with predictive 22nm technology are used to analyze performance metrics and exhaustive simulation results are presented for various reversible CMOS designs. Average power is improved upon by up to 91%, the peak power by up to 96%, and the differential power is improved by up to a factor of 128.57.
  • Keywords
    CMOS logic circuits; logic design; low-power electronics; CMOS circuits; CMOS operation; HSPICE simulations; Landauer barrier; differential power analysis; forward body biased adiabatic logic; peak power consumption; performance metrics; power reduction; quantum mechanical principles; reversible CMOS designs; reversible logic; side-channel attacks; size 22 nm; transistor scaling; ultra-low power computing circuits; ultra-low power levels; CMOS integrated circuits; Integrated circuit modeling; Inverters; Logic gates; Power demand; Semiconductor device modeling; Transistors; Adiabatic Logic; Forward Body Biasing; Reversible Logic;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Design and 2014 13th International Conference on Embedded Systems, 2014 27th International Conference on
  • Conference_Location
    Mumbai
  • ISSN
    1063-9667
  • Type

    conf

  • DOI
    10.1109/VLSID.2014.88
  • Filename
    6733177