Title :
The application of genetic algorithm for pin-fin heat sink optimization design
Author :
Wang, Yuying ; Li, Yunze ; Liu, Dongxiao
Author_Institution :
Sch. of Aeronaut. Sci. & Eng., BeiHang Univ., Beijing, China
Abstract :
The thermal management of electronic components will be challenging due to their continually rising of high heat flux densities but decreasing of sizes. The design of cooling equipments with simple configuration and high work efficiency is important for the whole system´s work safety. In this paper fin-fin heat sink´s work characteristics are calculated and the optimal design criterions are gained based on genetic algorithm (GA). A compositive optimization model that reflects the dynamic response and pressure drop traits is developed through the analysis of thermal capacity(Ct) and time constant(tau). Finally, results for the equipment´s optimal design under different design strategies were got from the optimum calculation. Results show that optimization aimed at the compositive evaluate objective on the time constant tau and the pressure drop DeltaP of the heat sink can lead to satisfactory effects. These results may provide references to designers and further research on micro-electronic components´ cooling.
Keywords :
cooling; dynamic response; genetic algorithms; heat sinks; integrated circuit design; integrated circuit packaging; specific heat; thermal management (packaging); compositive optimization model; cooling equipments; dynamic response; electronic components; genetic algorithm; heat flux densities; microelectronic components; pin-fin heat sink optimization design; pressure drop traits; simple configuration; thermal capacity analysis; thermal management; time constant analysis; work efficiency; Algorithm design and analysis; Design engineering; Design optimization; Electronic components; Electronics cooling; Genetic algorithms; Heat engines; Heat sinks; Resistance heating; Space heating; electronic components; genetic algorithm (GA); optimization; pin-fin heat sink; pressure drop;
Conference_Titel :
Industrial Electronics and Applications, 2009. ICIEA 2009. 4th IEEE Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4244-2799-4
Electronic_ISBN :
978-1-4244-2800-7
DOI :
10.1109/ICIEA.2009.5138723