DocumentCode :
2340935
Title :
11th IEEE International Conference on Advanced Thermal Processing of Semiconductors. RTP 2003
fYear :
2003
fDate :
23-26 Sept. 2003
Abstract :
The following topics were dealt: rapid thermal processing; melting point; semiconductor industry; CMOS; traceability of RTP temperature measurements; measurements and calibration methods; industry wide emissivity standards initiative; advanced technologies.
Keywords :
CMOS integrated circuits; batch processing (industrial); computational fluid dynamics; emissivity; ion implantation; isolation technology; laser beam annealing; melting point; rapid thermal processing; reflectivity; CMOS; RTP temperature measurements traceability; advanced technologies; advanced thermal processing; calibration methods; industry wide emissivity standards; melting point; rapid thermal processing; semiconductor industry; CMOS integrated circuits; Ion implantation; Isolation technology; Laser annealing; Optical reflection; Rapid thermal processing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Thermal Processing of Semiconductors, 2003. RTP 2003. 11th IEEE International Conference on
Conference_Location :
Charleston, SC, USA
Print_ISBN :
0-7803-7874-1
Type :
conf
DOI :
10.1109/RTP.2003.1249116
Filename :
1249116
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2340935
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