DocumentCode :
2340947
Title :
Thermal performance challenges for rapid thermal processing
Author :
Hebb, Jeff
Author_Institution :
Axcelis Technol. Inc., Beverly, MA, USA
fYear :
2003
fDate :
23-26 Sept. 2003
Firstpage :
3
Lastpage :
12
Abstract :
As devices scale to smaller dimensions, the capabilities of rapid thermal processing (RTP) equipment are continually challenged. Thermal performance challenges in the areas of advanced silicidation, ultrashallow junction formation, and process control are discussed.
Keywords :
integrated circuit manufacture; nickel compounds; process control; rapid thermal processing; semiconductor junctions; Ni2Si; RTP; process control; rapid thermal processing; silicidation; thermal performance; ultrashallow junction formation; Cobalt; Conductivity; Manufacturing processes; Nickel; Process control; Rapid thermal processing; Silicidation; Silicides; Space technology; Temperature control;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Thermal Processing of Semiconductors, 2003. RTP 2003. 11th IEEE International Conference on
Print_ISBN :
0-7803-7874-1
Type :
conf
DOI :
10.1109/RTP.2003.1249118
Filename :
1249118
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2340947
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