• DocumentCode
    2340947
  • Title

    Thermal performance challenges for rapid thermal processing

  • Author

    Hebb, Jeff

  • Author_Institution
    Axcelis Technol. Inc., Beverly, MA, USA
  • fYear
    2003
  • fDate
    23-26 Sept. 2003
  • Firstpage
    3
  • Lastpage
    12
  • Abstract
    As devices scale to smaller dimensions, the capabilities of rapid thermal processing (RTP) equipment are continually challenged. Thermal performance challenges in the areas of advanced silicidation, ultrashallow junction formation, and process control are discussed.
  • Keywords
    integrated circuit manufacture; nickel compounds; process control; rapid thermal processing; semiconductor junctions; Ni2Si; RTP; process control; rapid thermal processing; silicidation; thermal performance; ultrashallow junction formation; Cobalt; Conductivity; Manufacturing processes; Nickel; Process control; Rapid thermal processing; Silicidation; Silicides; Space technology; Temperature control;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Thermal Processing of Semiconductors, 2003. RTP 2003. 11th IEEE International Conference on
  • Print_ISBN
    0-7803-7874-1
  • Type

    conf

  • DOI
    10.1109/RTP.2003.1249118
  • Filename
    1249118
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2340947