• DocumentCode
    2341
  • Title

    Influence of Buffer Carbon Doping on Pulse and AC Behavior of Insulated-Gate Field-Plated Power AlGaN/GaN HEMTs

  • Author

    Verzellesi, G. ; Morassi, L. ; Meneghesso, Gaudenzio ; Meneghini, Matteo ; Zanoni, Enrico ; Pozzovivo, G. ; Lavanga, S. ; Detzel, T. ; Haberlen, O. ; Curatola, G.

  • Author_Institution
    Dipt. di Sci. e Metodi dell´Ing., En&Tech-Univ. of Modena & Reggio Emilia, Reggio Emilia, Italy
  • Volume
    35
  • Issue
    4
  • fYear
    2014
  • fDate
    Apr-14
  • Firstpage
    443
  • Lastpage
    445
  • Abstract
    Pulse behavior of insulated-gate double-field-plate power AlGaN/GaN HEMTs with C-doped buffers showing small current-collapse effects and dynamic RDS,on increase can accurately be reproduced by numerical device simulations that assume the CN-CGa autocompensation model as carbon doping mechanism. Current-collapse effects much larger than experimentally observed are instead predicted by simulations if C doping is accounted by dominant acceptor states. This suggests that buffer growth conditions favoring CN-CGa autocompensation can allow for the fabrication of power AlGaN/GaN HEMTs with reduced current-collapse effects. The drain-source capacitance of these devices is found to be a sensitive function of the C doping model, suggesting that its monitoring can be adopted as a fast technique to assess buffer compensation properties.
  • Keywords
    III-V semiconductors; aluminium compounds; carbon; doping profiles; gallium compounds; insulated gate field effect transistors; power HEMT; wide band gap semiconductors; AC behavior; AlGaN-GaN; CN-CGa autocompensation model; buffer carbon doping; buffer compensation; buffer growth; current collapse effects; dominant acceptor states; drain-source capacitance; insulated gate field plated power HEMT; numerical device simulations; pulse behavior; Aluminum gallium nitride; Carbon; Doping; Gallium nitride; HEMTs; MODFETs; Semiconductor process modeling; GaN HEMTs; GaN HFETs; GaN MOSHEMTs; carbon doping; current collapse;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2014.2304680
  • Filename
    6747334