DocumentCode
2341194
Title
Study of the radiative properties of silicon-based materials for thermal processing and control
Author
Zhang, Z.M. ; Lee, B.J. ; Lee, H.J.
Author_Institution
George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fYear
2003
fDate
23-26 Sept. 2003
Firstpage
107
Lastpage
115
Abstract
Radiative properties are important for radiometric temperature measurements and thermal control during materials processing. Although there have been extensive studies of the radiative properties of silicon and related materials, existing model expressions do not cover some important spectral and temperature ranges of practical interests. In the present study, selected optical models are summarized and used to calculate the optical constants of lightly doped silicon, with necessary extrapolations. The effect of coatings covering one or both sides of a smooth silicon wafer is studied at room temperature as well as at elevated temperatures. Furthermore, the influence of surface roughness on the radiative properties of semitransparent wafers with a dielectric coating is also examined. This work demonstrates the need for a more thorough investigation, with the assistance of high-accuracy measurements, of the radiative properties of silicon-based materials at elevated temperatures.
Keywords
elemental semiconductors; emissivity; rapid thermal processing; reflectivity; refractive index; semiconductor thin films; silicon; surface roughness; 293 to 298 K; Si; dielectric coating; lightly doped silicon; optical constants; radiative properties; radiometric temperature; room temperature; semitransparent wafers; silicon-based materials; smooth silicon wafer; surface roughness; thermal control; thermal processing; Coatings; Materials processing; Optical materials; Process control; Radio control; Radiometry; Semiconductor device modeling; Silicon; Temperature control; Temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Thermal Processing of Semiconductors, 2003. RTP 2003. 11th IEEE International Conference on
Print_ISBN
0-7803-7874-1
Type
conf
DOI
10.1109/RTP.2003.1249130
Filename
1249130
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