Title :
Compound material for injection molded PEM fuel cell bipolar plates
Author :
Kuo, Jenn-Kun ; Chang, Shiuh-Ming
Author_Institution :
Grad. Inst. of Greenergy Technol., Nat. Univ. of Tainan, Tainan
Abstract :
This paper develops a novel composite material for the bipolar plates in proton exchange membrane fuel cells (PEMFCs). In general, the materials used to fabricate PEMFC bipolar plates must be low-cost, easily fabricated, light, strong, mechanically stable, and have a low surface contact resistance. Therefore, this study fabricates bipolar plates using a composite material comprising Nylon-6 and S316L stainless steel alloy fibers. The PEMFC plates are fabricated via an injection molding process, which yields better production rates than coating or treating metal plates with a suitable surface material. It is shown that the developed composite material has a suitable combination of properties and processability for PEMFC bipolar plate applications. Specifically, the chemical and electrochemical properties of the plates are found to be stable, and the plates demonstrate good anti-corrosion characteristics, resulting in an enhanced electrical conductivity, a stable cell performance, and an extended cell life.
Keywords :
composite materials; conducting polymers; contact resistance; corrosion resistance; electrical conductivity; electrochemistry; filled polymers; injection moulding; proton exchange membrane fuel cells; stainless steel; surface resistance; Nylon-6; PEM fuel cell bipolar plates; S316L stainless steel alloy fibers; anticorrosion characteristics; composite material; compound material; electrical conductivity; electrochemical properties; injection molding process; proton exchange membrane fuel cells; surface contact resistance; Biomembranes; Composite materials; Contact resistance; Fuel cells; Injection molding; Iron alloys; Protons; Steel; Surface resistance; Surface treatment;
Conference_Titel :
Sustainable Energy Technologies, 2008. ICSET 2008. IEEE International Conference on
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-1887-9
Electronic_ISBN :
978-1-4244-1888-6
DOI :
10.1109/ICSET.2008.4746990