DocumentCode :
2342056
Title :
A comprehensive study of failure mode in IGBT applications due to freewheeling diode snappy recovery
Author :
Rahimo, M.T.
Author_Institution :
Power Dev., Mitel Semicond., Lincoln, UK
Volume :
2
fYear :
1998
fDate :
12-15 Oct. 1998
Firstpage :
840
Abstract :
In modern power converter circuits, freewheeling diode snappy recovery phenomenon (voltage snap-off) can ultimately destroy the insulated gate bipolar transistor (IGBT) during turn-on and cause a subsequent circuit failure. In this paper, snappy recovery of modern fast power diodes is investigated with the aid of semiconductor device simulation tools, and experimental test results. The work presented here confirms that the reverse recovery process can by expressed by means of diode capacitive effects which influence the reverse recovery characteristics and determine if the diode exhibits soft or snappy recovery behavior. From the experimental and simulation results, a clear view is obtained for the physical process, causes and device/circuit conditions at which snap-off occurs. The analysis is based on the effect of both device and external operating parameters on the excess minority carrier distributions before and during the reverse recovery transient period.
Keywords :
failure analysis; insulated gate bipolar transistors; power bipolar transistors; power convertors; semiconductor device models; semiconductor device reliability; semiconductor device testing; excess minority carrier distribution; experimental test results; failure mode; freewheeling diode snappy recovery; insulated gate bipolar transistor; operating parameters; power IGBT; power converter circuits; reverse recovery transient period; semiconductor device simulation; voltage snap-off; Choppers; Circuits; Insulated gate bipolar transistors; Maintenance; Modems; Semiconductor diodes; Switching converters; Switching loss; Transient analysis; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industry Applications Conference, 1998. Thirty-Third IAS Annual Meeting. The 1998 IEEE
Conference_Location :
St. Louis, MO, USA
ISSN :
0197-2618
Print_ISBN :
0-7803-4943-1
Type :
conf
DOI :
10.1109/IAS.1998.730243
Filename :
730243
Link To Document :
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