Title :
Growth modes and characterization of thin RTP silicon oxides
Author :
Eisele, I. ; Ludsteck, A. ; Schulze, J. ; Nenyei, Z.
Author_Institution :
Inst. fur Phys., Univ. der Bundeswehr Munchen, Neubiberg, Germany
Abstract :
For thin thermally grown oxides it is necessary to consider not only the transport of oxygen from the gas phase to the Si/SiO2 interface but also the transport of silicon to the surface. The latter causes a SiO2 growth at the SiO2/gas interface and/or a desorption of the oxide as is known for instance from ultra high vacuum processing such as molecular beam epitaxy. Using well defined argon/oxygen mixtures in a RTP system the process can be switched between growth and cleaning (etching). Depending on process conditions the quality of thin oxides varies significantly with respect to interface quality and tunneling currents. The presented model explains this behaviour based on excess oxygen or silicon in the grown film. The optimum quality can be achieved if growth conditions near the equilibrium of the two processes are chosen.
Keywords :
desorption; elemental semiconductors; etching; interface structure; oxidation; rapid thermal processing; semiconductor process modelling; semiconductor-insulator boundaries; silicon; silicon compounds; surface cleaning; surface structure; tunnelling; Deal-Grove-Model; RTP system; Si transport; Si-SiO2; Si/SiO2 interface; SiO; SiO desorption; SiO2; SiO2 growth; SiO2/gas interface; first order approximation; growth conditions; interface quality; model; process conditions; surface cleaning; surface etching; thermally grown oxides; tunneling currents; Cleaning; Etching; Fabrication; Furnaces; Molecular beam epitaxial growth; Semiconductor films; Semiconductor process modeling; Silicon; Temperature; Tunneling;
Conference_Titel :
Advanced Thermal Processing of Semiconductors, 2002. RTP 2002. 10th IEEE International Conference of
Print_ISBN :
0-7803-7465-7
DOI :
10.1109/RTP.2002.1039433