• DocumentCode
    2342300
  • Title

    UHV-STM system combined with MBE

  • Author

    Nomura, Takashi ; Yago, Haruo ; Awano, Haruyuki ; Ishikawa, Kenji ; Hagino, Minoru

  • Author_Institution
    Res. Inst. of Electron., Shizuoka Univ., Hamamatsu, Japan
  • fYear
    1994
  • fDate
    10-12 May 1994
  • Firstpage
    1427
  • Abstract
    To study the initial growth stage of molecular beam epitaxy (MBE), we develop a scanning tunneling microscope (STM) combined with MBE. The designs of the STM unit, current detection circuit, and control software are described. The STM unit operates in UHV environment and is designed to mount the same sample holder used during the MBE growth. The rigid sample transfer mechanism is constructed allowing the certain amount of clearance required to an UHV transfer system. The bias voltage is applied to the tip instead of the sample, because the MBE grown sample is electrically grounded to its sample holder. The control software is developed for scan control, data acquisition and imaging. An ordered modular structure of the software and an easy maintenance is achieved by means of the object-oriented programming method
  • Keywords
    computerised control; computerised instrumentation; image processing; molecular beam epitaxial growth; physical instrumentation control; scanning tunnelling microscopy; semiconductor materials; vacuum techniques; MBE; UHV environment; UHV-STM; bias voltage; control software; current detection circuit; data acquisition; imaging; maintenance; molecular beam epitaxy; object-oriented programming; ordered modular structure; sample holder; scan control; scanning tunneling microscope; Circuits; Gears; Microscopy; Molecular beam epitaxial growth; Optical device fabrication; Optical imaging; Surface contamination; Tunneling; Vacuum systems; Vibrations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Instrumentation and Measurement Technology Conference, 1994. IMTC/94. Conference Proceedings. 10th Anniversary. Advanced Technologies in I & M., 1994 IEEE
  • Conference_Location
    Hamamatsu
  • Print_ISBN
    0-7803-1880-3
  • Type

    conf

  • DOI
    10.1109/IMTC.1994.352164
  • Filename
    352164