The Cause Analysis Model of Pseudo Solder for Chip Component

A cause analysis model of pseudo solder for chip component is presented. Based on analyzing the causes of the chip pseudo solder, an comprehensive equation, which is composed of an ellipse equation and a circle equation, is used to fit the surface shape of chip solder joint. On the basis of that, the chip pseudo solder model is presented. All the parameters of the chip pseudo solder model are effected by the surface mounted technology process, such as solder paste printing process, mounting processing, reflowing process and so on. Experiments results show that the surface shape of the chip solder joint is fit effectively by the comprehensive equation. Experiments results also show that parameters of the chip pseudo solder model can illustrate the cause of pseudo solder effectively.