Title :
Thermal deformation measurement and evaluation of printed circuit board by using holography
Author :
Taniguchi, Masanari ; Takagi, Tasuku
Author_Institution :
Fac. of Sci. & Technol., Meijo Univ., Nagoya, Japan
Abstract :
Since a recent trend of miniaturization in electronic system makes the electronic circuit high density on the printed circuit board (PCB), the microscopical deformation measurement of PW due to thermal stress became one of the important problems as the density increases. In this study, using a holographic interferometry measuring technique, the deformation pattern of PCB surface due to heat generated by mounted electronic devices on the PCB was measured
Keywords :
deformation; holographic interferometry; printed circuit testing; thermal stresses; PCB; deformation pattern; holographic interferometry; holography; microscopical deformation measurement; miniaturization; printed circuit board; thermal deformation measurement; thermal stress; Circuit testing; Computer graphics; Holography; Integrated circuit testing; Interferometry; Laser beams; Printed circuits; Stress measurement; Surface emitting lasers; Thermal stresses;
Conference_Titel :
Instrumentation and Measurement Technology Conference, 1994. IMTC/94. Conference Proceedings. 10th Anniversary. Advanced Technologies in I & M., 1994 IEEE
Conference_Location :
Hamamatsu
Print_ISBN :
0-7803-1880-3
DOI :
10.1109/IMTC.1994.352192
