Title :
Microchannel integrated heat sinks in silicon technology
Author :
Perret, C. ; Schaeffer, Ch ; Boussey, J.
Author_Institution :
Lab. d´´Electrotech. de Grenoble, CNRS, St. Martin d´´Heres, France
Abstract :
The use of microchannels in silicon substrates as a forced liquid cooling device for power integrated circuits is investigated. Thermal dissipation characteristics are calculated for several microchannels geometry. An optimised structure is proposed and its technological realisation is described.
Keywords :
elemental semiconductors; heat sinks; power integrated circuits; silicon; substrates; Si; Si substrates; forced liquid cooling device; microchannel integrated heat sinks; microchannels geometry; optimised structure; power integrated circuits; silicon substrates; silicon technology; thermal dissipation characteristics; Cooling; Copper; Heat sinks; Heat transfer; Microchannel; Resistance heating; Silicon; Thermal conductivity; Thermal resistance; Water heating;
Conference_Titel :
Industry Applications Conference, 1998. Thirty-Third IAS Annual Meeting. The 1998 IEEE
Conference_Location :
St. Louis, MO, USA
Print_ISBN :
0-7803-4943-1
DOI :
10.1109/IAS.1998.730276
