Miniaturization platform for wireless sensor nodes based on 3D-packaging technologies

Author

Niedermayer, M. ; Guttowski, S. ; Thomasius, R. ; Polityko, D. ; Schrank, K. ; Reichl, H.

Author_Institution

Adv. Syst. Design, Fraunhofer-Inst. for Relibility & Microintegration, Berlin

fYear

0

fDate

0-0 0

Firstpage

391

Lastpage

398

Abstract

Miniaturized wireless sensors are mostly easier to integrate into everyday objects and show very high mechanical robustness. The development of these embedded micro systems has to consider the interdependence of design decisions regarding network communication, wireless sensor hardware and fabrication technology. An event driven simulator in combination with a 3D placement tool was used to predict the total system volume. The potential miniaturization degree is derived according to different 3D packaging technologies. The results are verified by prototype implementations

Keywords

intelligent sensors; microsensors; packaging; wireless sensor networks; 3D packaging technology; 3D placement tool; embedded microsystem; event driven simulator; fabrication technology; miniaturization platform; wireless sensor network; Discrete event simulation; Fabrication; Hardware; Mechanical sensors; Packaging; Predictive models; Robustness; Sensor systems; Wireless communication; Wireless sensor networks; 3D packaging; Wireless sensor systems; design methodology; hetero system integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Information Processing in Sensor Networks, 2006. IPSN 2006. The Fifth International Conference on

Conference_Location

Nashville, TN

Print_ISBN

1-59593-334-4

Type

conf

DOI

10.1109/IPSN.2006.243878

Filename

1662483