Design and modeling of vacuum packaged MEMS thermoelectric power generator using heat dissipation path

Author

Xie, Jin ; Lee, Chengkuo

Author_Institution

Inst. of Microelectron. (IME), Agency for Sci. Technol. & Res. (A*STAR), Singapore

fYear

2008

fDate

24-27 Nov. 2008

Firstpage

542

Lastpage

545

Abstract

A new concept of MEMS based thermoelectric power generator (TPG) is investigated in this study. By using solder based wafer bonding technology, we can bond three pieces of wafers to form vacuum packaged TPG. According to the finite element method and analytical modeling results, the output power per area of device is derived as 68.6 muW/cm² for temperature difference of 6degC between two ends of thermocouple junctions. It shows that the proposed device concept is an effective and low cost approach to enhance the output voltage.

Keywords

cooling; electronics packaging; finite element analysis; micromechanical devices; thermoelectric conversion; vacuum techniques; wafer bonding; TPG; finite element method; heat dissipation path; thermocouple junctions; vacuum packaged MEMS thermoelectric power generator; wafer bonding technology; Analytical models; Finite element methods; Micromechanical devices; Packaging; Power generation; Semiconductor device modeling; Temperature; Thermoelectricity; Vacuum technology; Wafer bonding; Energy harvester; MEMS; Power generator; Thermoelectric;

fLanguage

English

Publisher

ieee

Conference_Titel

Sustainable Energy Technologies, 2008. ICSET 2008. IEEE International Conference on

Conference_Location

Singapore

Print_ISBN

978-1-4244-1887-9

Electronic_ISBN

978-1-4244-1888-6

Type

conf

DOI

10.1109/ICSET.2008.4747067

Filename

4747067