Title :
Design and modeling of vacuum packaged MEMS thermoelectric power generator using heat dissipation path
Author :
Xie, Jin ; Lee, Chengkuo
Author_Institution :
Inst. of Microelectron. (IME), Agency for Sci. Technol. & Res. (A*STAR), Singapore
Abstract :
A new concept of MEMS based thermoelectric power generator (TPG) is investigated in this study. By using solder based wafer bonding technology, we can bond three pieces of wafers to form vacuum packaged TPG. According to the finite element method and analytical modeling results, the output power per area of device is derived as 68.6 muW/cm2 for temperature difference of 6degC between two ends of thermocouple junctions. It shows that the proposed device concept is an effective and low cost approach to enhance the output voltage.
Keywords :
cooling; electronics packaging; finite element analysis; micromechanical devices; thermoelectric conversion; vacuum techniques; wafer bonding; TPG; finite element method; heat dissipation path; thermocouple junctions; vacuum packaged MEMS thermoelectric power generator; wafer bonding technology; Analytical models; Finite element methods; Micromechanical devices; Packaging; Power generation; Semiconductor device modeling; Temperature; Thermoelectricity; Vacuum technology; Wafer bonding; Energy harvester; MEMS; Power generator; Thermoelectric;
Conference_Titel :
Sustainable Energy Technologies, 2008. ICSET 2008. IEEE International Conference on
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-1887-9
Electronic_ISBN :
978-1-4244-1888-6
DOI :
10.1109/ICSET.2008.4747067
