DocumentCode
2344291
Title
2002 Proceedings. 8th International Advanced Packaging Materials Symposium (Cat. No.02TH8617)
fYear
2002
fDate
3-6 March 2002
Abstract
The following topics are dealt with: packaging materials; adhesives; underfills; encapsulants and coatings; bumping materials and processing; manufacturing and reliability; MEMS; solders; substrates and HDI; dielectric materials; ´and passive materials.
Keywords
adhesives; coatings; dielectric materials; encapsulation; micromechanical devices; packaging; reliability; soldering; substrates; HDI; MEMS; adhesives; bumping materials; coatings; dielectrics; encapsulants; manufacturing; passive materials; reliability; solders; substrates; underfills; Packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Packaging Materials, 2002. Proceedings. 2002 8th International Symposium on
Conference_Location
Stone Mountain, GA, USA
Print_ISBN
0-7803-7434-7
Type
conf
DOI
10.1109/ISAPM.2002.990355
Filename
990355
Link To Document