• DocumentCode
    2344436
  • Title

    Analysis of on-chip interconnection network interface reliability in multicore systems

  • Author

    Zou, Yong ; Xiang, Yi ; Pasricha, Sudeep

  • Author_Institution
    Colorado State Univ., Fort Collins, CO, USA
  • fYear
    2011
  • fDate
    9-12 Oct. 2011
  • Firstpage
    427
  • Lastpage
    428
  • Abstract
    In Networks-on-Chip (NoC), with ever-increasing complexity and technology scaling, transient single-event upsets (SEUs) have become a key design challenge. In this work, we extend the concept of architectural vulnerability factor (AVF) from the microprocessor domain and propose a network vulnerability factor (NVF) to characterize the susceptibility of NoC components such as the Network Interface (NI) to transient faults. Our studies reveal that different NI buffers behave quite differently on transient faults and each buffer can have different levels of inherent fault-tolerant capability. Our analysis also considers the impact of thermal hotspot mitigation techniques such as frequency throttling on the NVF estimation.
  • Keywords
    fault tolerant computing; microprocessor chips; multiprocessing systems; multiprocessor interconnection networks; network-on-chip; transient analysis; architectural vulnerability factor; fault-tolerant capability; frequency throttling; microprocessor domain; multicore system; network vulnerability factor estimation; networks-on-chip; on-chip interconnection network interface reliability; technology scaling; thermal hotspot mitigation; transient single-event upsets; Estimation; Fault tolerance; Fault tolerant systems; Nickel; Process control; Protocols; Transient analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Design (ICCD), 2011 IEEE 29th International Conference on
  • Conference_Location
    Amherst, MA
  • ISSN
    1063-6404
  • Print_ISBN
    978-1-4577-1953-0
  • Type

    conf

  • DOI
    10.1109/ICCD.2011.6081433
  • Filename
    6081433