Title :
Analysis of on-chip interconnection network interface reliability in multicore systems
Author :
Zou, Yong ; Xiang, Yi ; Pasricha, Sudeep
Author_Institution :
Colorado State Univ., Fort Collins, CO, USA
Abstract :
In Networks-on-Chip (NoC), with ever-increasing complexity and technology scaling, transient single-event upsets (SEUs) have become a key design challenge. In this work, we extend the concept of architectural vulnerability factor (AVF) from the microprocessor domain and propose a network vulnerability factor (NVF) to characterize the susceptibility of NoC components such as the Network Interface (NI) to transient faults. Our studies reveal that different NI buffers behave quite differently on transient faults and each buffer can have different levels of inherent fault-tolerant capability. Our analysis also considers the impact of thermal hotspot mitigation techniques such as frequency throttling on the NVF estimation.
Keywords :
fault tolerant computing; microprocessor chips; multiprocessing systems; multiprocessor interconnection networks; network-on-chip; transient analysis; architectural vulnerability factor; fault-tolerant capability; frequency throttling; microprocessor domain; multicore system; network vulnerability factor estimation; networks-on-chip; on-chip interconnection network interface reliability; technology scaling; thermal hotspot mitigation; transient single-event upsets; Estimation; Fault tolerance; Fault tolerant systems; Nickel; Process control; Protocols; Transient analysis;
Conference_Titel :
Computer Design (ICCD), 2011 IEEE 29th International Conference on
Conference_Location :
Amherst, MA
Print_ISBN :
978-1-4577-1953-0
DOI :
10.1109/ICCD.2011.6081433