• DocumentCode
    2344454
  • Title

    High power 4H-SiC thyristors

  • Author

    Palmour, J.W. ; Singh, R. ; Waltz, D.G.

  • Author_Institution
    Cree Res. Inc., Durham, NC, USA
  • fYear
    1996
  • fDate
    26-26 June 1996
  • Firstpage
    54
  • Lastpage
    55
  • Abstract
    For very high voltage, high current devices (>3 kV, >100 A), the use of bipolar SiC devices will be required because of their much higher current densities. These devices have applications in the area of traction control and power transmission. In this report, higher voltage and higher current npnp 4H-SiC thyristors have been achieved. The npnp device is the most promising thyristor structure to date because it allows the use of a low resistivity n-type substrate. A mesa structure was utilized, with all of the doping being done in situ during epitaxy. The device periphery was terminated using a reactive ion etched mesa, and the gate was contacted by performing a trench etch, again with reactive ion etching.
  • Keywords
    semiconductor materials; silicon compounds; thyristors; 100 A; 3 kV; SiC; bipolar npnp device; epitaxy; high power 4H-SiC thyristor; in situ doping; mesa structure; reactive ion etching; trench gate etching; Conductivity; Current density; Doping; Epitaxial growth; Etching; Power transmission; Silicon carbide; Substrates; Thyristors; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Device Research Conference, 1996. Digest. 54th Annual
  • Conference_Location
    Santa Barbara, CA, USA
  • Print_ISBN
    0-7803-3358-6
  • Type

    conf

  • DOI
    10.1109/DRC.1996.546312
  • Filename
    546312