Title :
27th Annual Proceedings. Reliability Physics 1989 (Cat. No.89CH2650-0)
Abstract :
The following topics are dealt with: dielectric reliability; failure analysis; special devices and electrostatic discharge; hot-carrier effects; packaging issues; device reliability; electromigration; and metallization
Keywords :
electromigration; electrostatic discharge; failure analysis; hot carriers; integrated circuit technology; metallisation; packaging; reliability; semiconductor technology; device reliability; dielectric reliability; electromigration; electrostatic discharge; failure analysis; hot-carrier effects; metallization; packaging;
Conference_Titel :
Reliability Physics Symposium, 1989. 27th Annual Proceedings., International
Conference_Location :
Phoenix, AZ, USA
DOI :
10.1109/RELPHY.1989.36308
