Title :
A study of solid phase reactions at the Ge-GeO2 interface
Author :
Jishiashvili, D. ; Shiolashvili, Z. ; Gobronidze, V. ; Nakhutsrishvili, I.
Author_Institution :
Inst. of Cybern., Acad. of Sci., Tbilisi, Georgia
Abstract :
The sublimation of GeO molecules formed by the solid phase reaction between a-Ge and a-GeO2 films (Ge+GeO2=2GeO↑) was studied using vacuum microbalance. The c-Si/Ge/GeO2, c-Si/GeO2 /Ge, c-Ge/GeO2 and c-Si/GeO/GeO2 structures, fabricated by the ion-plasma deposition were annealed in the temperature range of 650-725°C. The diffusion of GeO molecules through the amorphous GeO 2 and Ge films was investigated. The calculated activation energy indicated that the sublimated molecules were (GeO)2 dimers. Dimeric (GeO)2 molecules were formed directly in the reaction zone at the Ge/GeO2 interface and after diffusion through the overlayer they were sublimated without decomposition. The sublimation rate of (GeO)2 was influenced by the degree of crystallinity of the Ge film. The Arrhenius expressions were obtained for calculation of diffusivities and permeability. Examination of the diffusion and permeation data suggests, that the process of diffusion through the GeO2 or Ge films limits the evaporation rate of (GeO)2
Keywords :
annealing; chemical interdiffusion; elemental semiconductors; germanium; germanium compounds; permeability; plasma deposited coatings; semiconductor-insulator boundaries; sublimation; 650 to 725 C; Arrhenius equation; Ge-GeO2; Ge-GeO2 interface; GeO; GeO molecule sublimation; a-Ge substrate; a-GeO2 film; activation energy; annealing; diffusivity; evaporation rate; ion plasma deposition; permeability; solid phase reaction; vacuum microbalance; Annealing; Crystallization; Kinetic theory; Packaging; Planarization; Rough surfaces; Semiconductor device modeling; Solids; Substrates; Surface roughness;
Conference_Titel :
Advanced Packaging Materials, 2002. Proceedings. 2002 8th International Symposium on
Conference_Location :
Stone Mountain, GA
Print_ISBN :
0-7803-7434-7
DOI :
10.1109/ISAPM.2002.990372