Title :
Development of low temperature processing thermoplastic intrinsically conductive polymer
Author :
Chow, Linda L W ; Li, J. ; Yuen, Matthew M F
Author_Institution :
Dept of Mech. Eng., Hong Kong Univ. of Sci. & Technol., China
Abstract :
To find an alternative to reliable eutectic solder interconnects for electronics, MEMS and optoelectronics packaging, a new thermoplastic intrinsically conductive polymer, doped polyaniline is proposed. It has an attractive low processing temperature, <50°C and it exhibits stable resistance with gold under Jedec level 1, 85°C/85% relative humidity for over 7 days. Cresol, the solvent, is a strong oxidizing agent to many metal; yet, XPS shows no corrosion on gold substrate. Die shear tests show that mechanical interlocking does play an important role. Etched surface with larger roughness has fourfold enhancement in shear strength
Keywords :
X-ray photoelectron spectra; conducting polymers; contact resistance; etching; shear strength; 50 C; 85 C; Au; XPS; contact resistance; cresol solvent; die shear test; doped polyaniline; etching; gold substrate; low temperature processing; mechanical interlocking; relative humidity; shear strength; surface roughness; thermoplastic intrinsically conductive polymer; Corrosion; Electronic packaging thermal management; Etching; Gold; Humidity; Micromechanical devices; Polymers; Solvents; Temperature; Testing;
Conference_Titel :
Advanced Packaging Materials, 2002. Proceedings. 2002 8th International Symposium on
Conference_Location :
Stone Mountain, GA
Print_ISBN :
0-7803-7434-7
DOI :
10.1109/ISAPM.2002.990375
