Title :
A study on improvement of thermal conductivity of underfill materials for electronic packaging
Author :
Li, Haiying ; Jacob, Karl ; Wong, C.P.
Author_Institution :
Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
Effective heat dissipation is crucial to enhance the performance and reliability of the electronic devices. In this paper, the performance of encapsulants filled with carbon fiber was studied and compared with silica filled encapsulants. Encapsulants filled with mixed combination of fillers for optimizing key properties were also investigated. The thermal conductance and electrical conductance were investigated and curing kinetics, glass transition temperature (Tg), thermal expansion coefficient (TCE), storage modulus (E´) of these materials were studied with thermal analysis methods. The carbon fiber and silica filled composites showed an increase of thermal conductivity three to four times of that of silica filled encapsulants of the same filler loading while maintaining/enhancing major mechanical and thermal properties, respectively
Keywords :
carbon fibre reinforced plastics; elastic moduli; electrical conductivity; encapsulation; filled polymers; glass transition; packaging; thermal analysis; thermal conductivity; thermal expansion; carbon fiber filled encapsulant; curing kinetics; electrical conductivity; electronic packaging; glass transition temperature; heat dissipation; mechanical properties; silica filled encapsulant; storage modulus; thermal analysis; thermal conductivity; thermal expansion coefficient; thermal properties; underfill material; Curing; Glass; Kinetic theory; Material storage; Optical fiber devices; Silicon compounds; Temperature; Thermal conductivity; Thermal expansion; Thermal loading;
Conference_Titel :
Advanced Packaging Materials, 2002. Proceedings. 2002 8th International Symposium on
Conference_Location :
Stone Mountain, GA
Print_ISBN :
0-7803-7434-7
DOI :
10.1109/ISAPM.2002.990388
