Low power, high throughput network-on-chip fabric for 3D multicore processors

Long wires degrade significantly the performance of network-on-chip (NoC) communication fabric in large multicore processors. 3D network-on-chip architecture alleviates the problem of long wires, but practical limitations of CMOS technology restrict such structures to two active layers only. In this work, we study a heterogeneous 3D chip with processor cores and cache blocks implemented in CMOS and NoC fabric in VeSFET technology. Such a 3D architecture shows significant improvements in all network parameters including latency, power and energy consumption compared to existing 3D NoCs.