DocumentCode
2344965
Title
Angled implant fully overlapped LDD (AI-FOLD) NFETs for performance and reliability
Author
Bryant, A. ; Furukawa, T. ; Mandelman, J. ; Mittl, S. ; Noble, W. ; Nowak, E. ; Wade, W. ; Ogura, S. ; Wordeman, M.
Author_Institution
IBM, Essex Junction, VT, USA
fYear
1989
fDate
11-13 Apr 1989
Firstpage
152
Lastpage
157
Abstract
Fully overlapped lightly doped drain FOLD n-channel MOSFETs built for the purpose of improving the tradeoff between performance and reliability are discussed. Full gate overlap was achieved by using angled implants to extend LDD (lightly-doped drain) regions beneath the gate edge of devices. The dose and energy of the angled implants were varied. The parasitic overlap capacitance and series resistance as well as the reliability enhancement introduced by the FOLD structure are investigated in detail. The series resistance is shown to be strongly dependent on gate voltage, while the overlap capacitance is found to be reduced significantly by depletion of the FOLD drain regions. The corresponding reduction in hot-carrier-limited channel length more than compensates for the increase in parasitics, indicating substantial enhancement in net drive performance
Keywords
insulated gate field effect transistors; ion implantation; reliability; semiconductor device testing; FOLD structure; angled implant fully overlapped LDD n-channel MOSFET; drive performance; gate overlap; gate voltage; hot-carrier-limited channel length; implant dose; implant energy; parasitic overlap capacitance; performance; reliability; series resistance; Degradation; Doping; Electrons; Fingers; Hot carriers; Implants; MOSFETs; Parasitic capacitance; Reliability engineering; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1989. 27th Annual Proceedings., International
Conference_Location
Phoenix, AZ
Type
conf
DOI
10.1109/RELPHY.1989.36337
Filename
36337
Link To Document