Title :
Adhesion improvement of thermoplastic isotropically conductive adhesive
Author :
Liong, S. ; Wong, C.P. ; Burgoyne, W.F., Jr.
Author_Institution :
Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
Generally, isotropically conductive adhesive formulations include epoxy resin as the polymeric matrix. Although epoxy has superior adhesion capability, its drawbacks include the tendency to absorb moisture and lack of reworkability (thermosetting polymer). In this study, a thermoplastic polymer with low moisture absorption (0.279 wt%), called polyarylene ether (PAE2), is used in isotropically conductive adhesive (ICA) formulation. Previous research work by Lu et. al. showed that the moisture absorbed into epoxy caused galvanic corrosion, which result in the formation of metal oxide. By using a polymer with low moisture absorption, the amount of water present in ICA will be small, and the corrosion rate and formation of metal oxide can be reduced. However, previous measurements of contact resistance stability of PAE2-based ICAs showed that they are not stable on all surface finishes. It was determined that for thermoplastic-based ICA, poor adhesion was the main mechanism for unstable contact resistance. Two methods of adhesion improvement will be evaluated in this work. The first is to use coupling agents and the second is to blend the thermoplastic with epoxy. Both methods showed promise in improving the contact resistance stability of polyarylene ether based ICA
Keywords :
adhesion; adhesives; conducting materials; contact resistance; corrosion; filled polymers; moisture; polymer blends; adhesion; contact resistance; coupling agent; epoxy blend; galvanic corrosion; isotropically conductive adhesive; metal oxide formation; moisture absorption; polyarylene ether; thermoplastic polymer; Absorption; Conductive adhesives; Contact resistance; Corrosion; Epoxy resins; Galvanizing; Independent component analysis; Moisture; Polymers; Stability;
Conference_Titel :
Advanced Packaging Materials, 2002. Proceedings. 2002 8th International Symposium on
Conference_Location :
Stone Mountain, GA
Print_ISBN :
0-7803-7434-7
DOI :
10.1109/ISAPM.2002.990397