• DocumentCode
    2345251
  • Title

    Simulation of short distance through signature considering multi-radiated sources of a ship

  • Author

    Jian, Luo ; Zhu, Xiong ; Yaqian, Zhan

  • Author_Institution
    Northwestern Polytech. Univ., Xi´´an
  • fYear
    2008
  • fDate
    3-5 June 2008
  • Firstpage
    1397
  • Lastpage
    1402
  • Abstract
    Owing to the fact that the radiated noises of three special sections of a ship (stern, the section between the stern and the midway of a ship, midway of a ship) present distinguished features of their power spectrum, it will be advantageous is significant to make use of them. In the present research, the simplified "three highlights" model for the ship-radiated noise at short distance is adopted to approach the continuous spectrum in these special sections. The convolution algorithm using a sliding time-window is used to regenerate the noise sequence of a special radiated source, the noise sequence has both specified amplitude probability distribution and desired power spectrum feature. Based on the reconstruction of the time-domain signals of the different radiated noise sources, the through signature and the additional effect of the three noise sources has been simulated. The results of simulation of the noise process are close to the actual testing data for a certain ship, both exhibiting the similar spectrum features.
  • Keywords
    convolution; hydrophones; ships; sonar signal processing; time-domain analysis; convolution algorithm; multiradiating noise sources; noise power spectrum; noise sequence amplitude probability distribution; noise sequence regeneration; ship radiated noise; ship stern; short distance noise; sliding time window; time domain signal reconstruction; Acoustic noise; Analytical models; Convolution; Frequency domain analysis; Linear systems; Low-frequency noise; Marine vehicles; Noise level; Signal processing algorithms; Testing; convolution algorithm using a sliding time-window; simulation of multi-sources noise; simulation of noise process; through signature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics and Applications, 2008. ICIEA 2008. 3rd IEEE Conference on
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-1717-9
  • Electronic_ISBN
    978-1-4244-1718-6
  • Type

    conf

  • DOI
    10.1109/ICIEA.2008.4582748
  • Filename
    4582748