DocumentCode
2345251
Title
Simulation of short distance through signature considering multi-radiated sources of a ship
Author
Jian, Luo ; Zhu, Xiong ; Yaqian, Zhan
Author_Institution
Northwestern Polytech. Univ., Xi´´an
fYear
2008
fDate
3-5 June 2008
Firstpage
1397
Lastpage
1402
Abstract
Owing to the fact that the radiated noises of three special sections of a ship (stern, the section between the stern and the midway of a ship, midway of a ship) present distinguished features of their power spectrum, it will be advantageous is significant to make use of them. In the present research, the simplified "three highlights" model for the ship-radiated noise at short distance is adopted to approach the continuous spectrum in these special sections. The convolution algorithm using a sliding time-window is used to regenerate the noise sequence of a special radiated source, the noise sequence has both specified amplitude probability distribution and desired power spectrum feature. Based on the reconstruction of the time-domain signals of the different radiated noise sources, the through signature and the additional effect of the three noise sources has been simulated. The results of simulation of the noise process are close to the actual testing data for a certain ship, both exhibiting the similar spectrum features.
Keywords
convolution; hydrophones; ships; sonar signal processing; time-domain analysis; convolution algorithm; multiradiating noise sources; noise power spectrum; noise sequence amplitude probability distribution; noise sequence regeneration; ship radiated noise; ship stern; short distance noise; sliding time window; time domain signal reconstruction; Acoustic noise; Analytical models; Convolution; Frequency domain analysis; Linear systems; Low-frequency noise; Marine vehicles; Noise level; Signal processing algorithms; Testing; convolution algorithm using a sliding time-window; simulation of multi-sources noise; simulation of noise process; through signature;
fLanguage
English
Publisher
ieee
Conference_Titel
Industrial Electronics and Applications, 2008. ICIEA 2008. 3rd IEEE Conference on
Conference_Location
Singapore
Print_ISBN
978-1-4244-1717-9
Electronic_ISBN
978-1-4244-1718-6
Type
conf
DOI
10.1109/ICIEA.2008.4582748
Filename
4582748
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