Title :
Experience gained manufacturing HDI PWBs
Author :
Rapala-Virtanen, T.
Author_Institution :
Aspocomp Group, Salo, Finland
Abstract :
Aspocomp has been manufacturing HDI PWBs at Salo for more than five years. The chief focus has been on increasing packaging density and on accommodating the needs of future chip scale packages. In volume production, cost and performance have to be balanced. As a result, manufacturing and material yields, process automation, the cost of materials and added value technologies like embedded passives are key considerations in meeting the high volume requirements of the marketplace. This paper will describe how these parameters have evolved over time and how it has been possible to achieve the stringent tolerances required in both the manufacturing and assembly processes.
Keywords :
chip scale packaging; printed circuit manufacture; tolerance analysis; HDI PWB manufacturing; assembly process; chip scale package; embedded passive; manufacturing process; manufacturing yield; material cost; material yield; packaging density; process automation; tolerance analysis; volume production; Chip scale packaging; Costs; Dielectric liquids; Dielectric materials; Manufacturing automation; Manufacturing processes; Production facilities; Resins; Resistors; Space technology;
Conference_Titel :
Advanced Packaging Materials, 2002. Proceedings. 2002 8th International Symposium on
Conference_Location :
Stone Mountain, GA, USA
Print_ISBN :
0-7803-7434-7
DOI :
10.1109/ISAPM.2002.990410
