Title :
Characterization and testing on integral passives for wireless applications
Author :
Kim, Bruce C. ; Han, Dae-Hyun ; Liu, Rong ; Yoon, Yeong J.
Author_Institution :
Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
Abstract :
This paper presents a characterization technique for integrated inductor in high frequency for wireless applications. We provide two methods for calculating the measured Q. We also describe the new test technique for integral passives in package substrates. The technique uses an active circuit to test passive circuits in substrates. The defect can be found with very high sensitivity due to the natural amplification of the active circuit used as a test apparatus
Keywords :
Q-factor; electron device testing; inductors; Q-factor; active circuit; defect detection; high-frequency testing; integral passive; integrated inductor; package substrate; passive circuit; test technique; wireless communication; Active circuits; Active inductors; Circuit testing; Equations; Frequency; Integrated circuit measurements; Packaging; Q factor; Silicon; Wireless sensor networks;
Conference_Titel :
Advanced Packaging Materials, 2002. Proceedings. 2002 8th International Symposium on
Conference_Location :
Stone Mountain, GA
Print_ISBN :
0-7803-7434-7
DOI :
10.1109/ISAPM.2002.990415
