DocumentCode :
2345502
Title :
A scaleable model for STI mechanical stress effect on layout dependence of MOS electrical characteristics
Author :
Su, Ke-Wei ; Sheu, Yi-Ming ; Lin, Chung-Kai ; Yang, Sheng-Jier ; Liang, Wen-Jya ; Xi, Xuemei ; Chiang, Chung-Shi ; Her, Jaw-Kang ; Chia, Yu-Tai ; Diaz, Carlos H. ; Hu, Chenming
Author_Institution :
Taiwan Semicond. Manuf. Co., Hsin-Chu, Taiwan
fYear :
2003
fDate :
21-24 Sept. 2003
Firstpage :
245
Lastpage :
248
Abstract :
This paper demonstrates a new compact and scaleable model of mechanical stress effects on MOS electrical performance, induced by shallow trench isolation (STI). This model has included the influence of STI stress not only on the mobility and saturation velocity, but also on the threshold voltage and other important second-order effects. Thus it could simulate the layout dependence of MOS performance with good accuracy and efficiency. We have verified this model with various device dimensions and layout styles of our advanced MOS technologies. And it shows the importance of this new model for circuit design in advanced CMOS generations.
Keywords :
MIS devices; isolation technology; semiconductor device models; stress analysis; CMOS circuit design; MOS electrical characteristics layout dependence; STI mechanical stress effects; mobility; saturation velocity; shallow trench isolation; threshold voltage; Analytical models; CMOS technology; Circuit simulation; Circuit synthesis; Electric variables; MOS devices; Semiconductor device modeling; Semiconductor process modeling; Stress; Threshold voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Custom Integrated Circuits Conference, 2003. Proceedings of the IEEE 2003
Print_ISBN :
0-7803-7842-3
Type :
conf
DOI :
10.1109/CICC.2003.1249396
Filename :
1249396
Link To Document :
بازگشت