Advances in RF packaging technologies for next-generation wireless communications applications [RFIC]

Author

Larson, Lawrence ; Jessie, Darryl

Author_Institution

Univ. of California, USA

fYear

2003

fDate

21-24 Sept. 2003

Firstpage

323

Lastpage

330

Abstract

The performance of a radio frequency integrated circuit can be dramatically affected by the package environment, yet packaging technology has received comparatively little attention compared to IC fabrication technology or RFIC design. This paper summarizes the key developments and trends in RFIC packaging, with particular attention to improvements in plastic package design, low-temperature co-fired ceramic (LTCC) flip-chip approaches, and system-in-package (SIP) implementations.

Keywords

ceramic packaging; flip-chip devices; integrated circuit packaging; plastic packaging; radiofrequency integrated circuits; LTCC; RF packaging technology; RFIC packaging; SIP; flip-chip packaging; low-temperature co-fired ceramic; plastic package design; radio frequency integrated circuit; system-in-package; wireless communications applications; Ceramics; Degradation; Integrated circuit packaging; Paper technology; Plastic integrated circuit packaging; Radio frequency; Radiofrequency integrated circuits; Satellite broadcasting; Wireless LAN; Wireless communication;

fLanguage

English

Publisher

ieee

Conference_Titel

Custom Integrated Circuits Conference, 2003. Proceedings of the IEEE 2003

Print_ISBN

0-7803-7842-3

Type

conf

DOI

10.1109/CICC.2003.1249412

Filename

1249412