Title :
Advances in RF packaging technologies for next-generation wireless communications applications [RFIC]
Author :
Larson, Lawrence ; Jessie, Darryl
Author_Institution :
Univ. of California, USA
Abstract :
The performance of a radio frequency integrated circuit can be dramatically affected by the package environment, yet packaging technology has received comparatively little attention compared to IC fabrication technology or RFIC design. This paper summarizes the key developments and trends in RFIC packaging, with particular attention to improvements in plastic package design, low-temperature co-fired ceramic (LTCC) flip-chip approaches, and system-in-package (SIP) implementations.
Keywords :
ceramic packaging; flip-chip devices; integrated circuit packaging; plastic packaging; radiofrequency integrated circuits; LTCC; RF packaging technology; RFIC packaging; SIP; flip-chip packaging; low-temperature co-fired ceramic; plastic package design; radio frequency integrated circuit; system-in-package; wireless communications applications; Ceramics; Degradation; Integrated circuit packaging; Paper technology; Plastic integrated circuit packaging; Radio frequency; Radiofrequency integrated circuits; Satellite broadcasting; Wireless LAN; Wireless communication;
Conference_Titel :
Custom Integrated Circuits Conference, 2003. Proceedings of the IEEE 2003
Print_ISBN :
0-7803-7842-3
DOI :
10.1109/CICC.2003.1249412
