DocumentCode
2345841
Title
Foundry technology for 130nm and beyond SoC
Author
Tang, Denny D. ; Diaz, C.H. ; Chao, C.P. ; Hsu, Hunming ; Lee, C.Y. ; Chang, C.S. ; Chia, Y.T. ; Yang, M.T. ; Sun, Jack Y C
Author_Institution
Taiwan Semicond. Manuf. Co., Hsinchu, Taiwan
fYear
2003
fDate
21-24 Sept. 2003
Firstpage
343
Lastpage
350
Abstract
Current foundry technology menus are so rich that they are sufficient to provide single chip solutions to a wide variety of desktop, portable and communication systems. At 130-nm and 90-nm generations, many of the device characteristics are no longer a straightforward extension of past generations. Special attention should be made for mixed-signal chip design. A judicious choice of devices and careful trade-off between version options should be made to maximize the benefit from the latest foundry offerings.
Keywords
integrated circuit technology; mixed analogue-digital integrated circuits; nanoelectronics; system-on-chip; 130 nm; 90 nm; SoC; communication systems; desktop systems; foundry technology; mixed-signal chip design; portable systems; single chip solutions; CMOS technology; Character generation; Foundries; Integrated circuit technology; Isolation technology; Leakage current; Manufacturing; Radio frequency; Silicon; Space technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Custom Integrated Circuits Conference, 2003. Proceedings of the IEEE 2003
Print_ISBN
0-7803-7842-3
Type
conf
DOI
10.1109/CICC.2003.1249416
Filename
1249416
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