Title :
1998 High-Temperature Electronic Materials, Devices and Sensors Conference (Cat. No.98EX132)
Abstract :
The following topics were dealt with: SiC technologies; Si and SOI technologies; III-V electronics/electro-optics and boron technologies; metallizations; passive components, packaging and reliability
Keywords :
electric sensing devices; high-temperature electronics; III-V electro-optics; III-V electronics; SOI technology; Si technology; SiC technology; boron technology; devices; high temperature electronic materials; metallization; packaging; passive components; reliability; sensors;
Conference_Titel :
High-Temperature Electronic Materials, Devices and Sensors Conference, 1998
Conference_Location :
San Diego, CA, USA
Print_ISBN :
0-7803-4437-5
DOI :
10.1109/HTEMDS.1998.730634
