DocumentCode :
2346353
Title :
Influence of short circuits on data of contact and via open circuits determined by a novel weave test structure
Author :
Hess, Christopher ; Weiland, Larg H.
Author_Institution :
Inst. of Comput. Design & Fault Tolerance, Karlsruhe Univ., Germany
fYear :
1995
fDate :
22-25 Mar 1995
Firstpage :
11
Lastpage :
16
Abstract :
The influence that short circuits have on contact hole open circuits and via hole open circuits in regular string test structures will be investigated. To detect open circuits as well as short circuits in adjacent conducting layers of backend process steps, a novel weave test structure (WTS) is presented. Numerous contact strings or via strings are arranged inside boundary pads like a woven piece of cloth. Thus, short circuits between different strings are also electrically detectable
Keywords :
electrical contacts; integrated circuit metallisation; integrated circuit testing; short-circuit currents; backend process; boundary pads; conducting layer; contact hole open circuits; defects; electrical detection; short circuits; string test structure; via hole open circuits; weave test structure; Circuit testing; Contacts; Fault tolerance; Manufacturing processes; Parameter extraction; Semiconductor device manufacture; Semiconductor device testing; Semiconductor devices; Semiconductor diodes;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microelectronic Test Structures, 1995. ICMTS 1995. Proceedings of the 1995 International Conference on
Conference_Location :
Nara
Print_ISBN :
0-7803-2065-4
Type :
conf
DOI :
10.1109/ICMTS.1995.513937
Filename :
513937
Link To Document :
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