Title :
Recent advances in high-voltage SiC power devices
Author :
Chow, T.P. ; Ramungul, N. ; Ghezzo, M.
Author_Institution :
Rensselaer Polytech. Inst., Troy, NY, USA
Abstract :
The present status of high-voltage SiC semiconductor switching devices is reviewed. The figures of merit that have been used for unipolar and bipolar devices to quantify the intrinsic performance improvement over silicon are presented. The choice and design of several key device structures are discussed. The performance expectations of the major two- and three-terminal unipolar and bipolar devices in 4H-SiC are presented. The recent rapid development of SiC material and process technology is described. The progress in high-voltage power device experimental demonstration is reviewed. The material and process technology issues that must be addressed for device commercialization are discussed
Keywords :
bipolar transistors; high-voltage techniques; power semiconductor switches; semiconductor device testing; semiconductor technology; silicon compounds; wide band gap semiconductors; 4H-SiC devices; SiC; SiC material technology; SiC process technology; bipolar devices; device commercialization; device structures; high-voltage SiC power devices; high-voltage SiC semiconductor switching devices; high-voltage power device; unipolar devices; Conducting materials; Gallium nitride; Photonic band gap; Power semiconductor switches; Semiconductor films; Semiconductor materials; Silicon carbide; Substrates; Thermal conductivity; Voltage;
Conference_Titel :
High-Temperature Electronic Materials, Devices and Sensors Conference, 1998
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-4437-5
DOI :
10.1109/HTEMDS.1998.730653