• DocumentCode
    2346396
  • Title

    Recent advances in high-voltage SiC power devices

  • Author

    Chow, T.P. ; Ramungul, N. ; Ghezzo, M.

  • Author_Institution
    Rensselaer Polytech. Inst., Troy, NY, USA
  • fYear
    1998
  • fDate
    22-27 Feb 1998
  • Firstpage
    55
  • Lastpage
    67
  • Abstract
    The present status of high-voltage SiC semiconductor switching devices is reviewed. The figures of merit that have been used for unipolar and bipolar devices to quantify the intrinsic performance improvement over silicon are presented. The choice and design of several key device structures are discussed. The performance expectations of the major two- and three-terminal unipolar and bipolar devices in 4H-SiC are presented. The recent rapid development of SiC material and process technology is described. The progress in high-voltage power device experimental demonstration is reviewed. The material and process technology issues that must be addressed for device commercialization are discussed
  • Keywords
    bipolar transistors; high-voltage techniques; power semiconductor switches; semiconductor device testing; semiconductor technology; silicon compounds; wide band gap semiconductors; 4H-SiC devices; SiC; SiC material technology; SiC process technology; bipolar devices; device commercialization; device structures; high-voltage SiC power devices; high-voltage SiC semiconductor switching devices; high-voltage power device; unipolar devices; Conducting materials; Gallium nitride; Photonic band gap; Power semiconductor switches; Semiconductor films; Semiconductor materials; Silicon carbide; Substrates; Thermal conductivity; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    High-Temperature Electronic Materials, Devices and Sensors Conference, 1998
  • Conference_Location
    San Diego, CA
  • Print_ISBN
    0-7803-4437-5
  • Type

    conf

  • DOI
    10.1109/HTEMDS.1998.730653
  • Filename
    730653