Silicon-on-organic integration of a 2.4GHz VCO using high Q copper inductors and solder-bumped flip chip technology

Author

Huo, X. ; Xiao, Guo-Wei ; Chen, Kevin J. ; Chan, Philip C H

Author_Institution

Dept. of Electr. & Electron. Eng., Hong Kong Univ. of Sci. & Technol., China

fYear

2003

fDate

21-24 Sept. 2003

Firstpage

537

Lastpage

540

Abstract

High Q copper inductors were fabricated on low-cost and low-loss BT and glass substrates using an electroplating process. A differential LC VCO circuit was designed using these high Q inductors at 2.4 GHz. Flip chip and MCM technology were applied to assemble the active chips on BT and glass substrates. The inductors exhibited a Q-factor as high as 30 at 2.4 GHz. VCOs with copper inductors on BT and glass substrates had a phase noise of -108 dBc/Hz at 600 kHz offset for a 2.4 GHz carrier, which is a 6 dB improvement compared with the one with on-chip Al inductors.

Keywords

Q-factor; UHF oscillators; copper; electroplating; flip-chip devices; inductors; multichip modules; phase noise; voltage-controlled oscillators; 2.4 GHz; BT substrate; Cu; MCM technology; differential LC VCO circuit; electroplating; glass substrate; high Q copper inductors; on-chip Al inductors; phase noise; silicon-on-organic integration; solder-bumped flip chip technology; Circuits; Copper; Dielectric substrates; Flip chip; Inductors; Q factor; Radio frequency; Silicon; Spirals; Voltage-controlled oscillators;

fLanguage

English

Publisher

ieee

Conference_Titel

Custom Integrated Circuits Conference, 2003. Proceedings of the IEEE 2003

Print_ISBN

0-7803-7842-3

Type

conf

DOI

10.1109/CICC.2003.1249455

Filename

1249455