DocumentCode
2346467
Title
The impact of device type and sizing on phase noise mechanisms [MOS VCOs]
Author
Jerng, A. ; Sodini, Charles G.
Author_Institution
Microsystems Technol. Lab., MIT, Cambridge, MA, USA
fYear
2003
fDate
21-24 Sept. 2003
Firstpage
547
Lastpage
550
Abstract
Phase noise mechanisms in integrated LC voltage-controlled oscillators (VCOs) using MOS transistors are investigated. The degradation in phase noise due to bias noise is shown to be a function of MOS device sizing. By exploiting this dependence, bias noise contributions to phase noise are minimized by design rather than through filtering. Concentrating on the remaining fundamental noise sources in the MOS cross-coupled pair, experimental results and reasoning are presented that explain why 0.18 μm PMOS devices show better phase noise than 0.18 μm NMOS devices in both the 1/f3 and 1/f2 regions. A 5.3 GHz all-PMOS VCO topology demonstrates measured phase noise of -122 dBc/Hz at 1 MHz offset while dissipating 13.5 mW from a 1.8 V supply.
Keywords
1/f noise; MMIC oscillators; MOS integrated circuits; integrated circuit noise; phase noise; voltage-controlled oscillators; 0.18 micron; 1.8 V; 13.5 mW; 5.3 GHz; MOS cross-coupled pair; MOS device sizing; MOS transistors; NMOS devices; PMOS devices; bias noise; integrated LC VCO; phase noise degradation; phase noise mechanisms; voltage-controlled oscillators; Circuit noise; Delay; Frequency; Integrated circuit noise; Low-frequency noise; MOS devices; Noise shaping; Phase noise; Topology; Voltage-controlled oscillators;
fLanguage
English
Publisher
ieee
Conference_Titel
Custom Integrated Circuits Conference, 2003. Proceedings of the IEEE 2003
Print_ISBN
0-7803-7842-3
Type
conf
DOI
10.1109/CICC.2003.1249457
Filename
1249457
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