Title :
Characterization and modeling of transistors embedded in a high performance bipolar logic array
Author_Institution :
Appl. Micro Circuits Corp., San Diego, CA, USA
Abstract :
A set of high-frequency test structures for device characterization and the extraction of DC, CV, and AC bipolar SPICE model parameters has been implemented on a triple layer metal, high-performance bipolar logic array. These structures have proven useful in the development of accurate, statistically based SPICE models, relying on a readily available bank of logic array product base wafers. Sample results and the use of Hewlett-Packard´s IC-CAP parameter extraction program to study these structures are discussed
Keywords :
bipolar logic circuits; integrated circuit modelling; integrated circuit testing; logic arrays; HF test structures; IC-CAP parameter extraction program; SPICE model parameters extraction; bipolar logic array; device characterization; embedded transistors; modeling; triple layer metal; Circuit testing; Logic arrays; Logic circuits; Logic devices; Logic testing; Production; Programmable logic arrays; SPICE; Semiconductor device modeling; Virtual manufacturing;
Conference_Titel :
Microelectronic Test Structures, 1995. ICMTS 1995. Proceedings of the 1995 International Conference on
Conference_Location :
Nara
Print_ISBN :
0-7803-2065-4
DOI :
10.1109/ICMTS.1995.513969
