Properties of high thermal conductivity carbon-carbon composites for thermal management applications

Author

Golecki, Ilan ; Xue, Liang ; Leung, Roger ; Walker, Terence ; Anderson, Alec ; Dewar, Douglas ; Duncan, Chris ; Van Horik, Jon

Author_Institution

Res. & Technol., Allied-Signal Inc., Morristown, NJ, USA

fYear

1998

fDate

22-27 Feb 1998

Firstpage

190

Lastpage

195

Abstract

Carbon (fiber)-carbon (matrix) composites have the highest thermal conductivity per unit density among materials suitable for thermal management applications. C-C composites also have high toughness and their mechanical strength increases with temperature. We have developed C-C materials and structures for heat management applications at elevated temperatures, using pitch-based fiber preforms. Densities of 2.0-2.2 g/cm³, in-plane thermal conductivity of 690 W/m.K and tensile strength of 400 MPa have been measured in thin panels. Structures suitable for thermal management aerospace applications have been fabricated

Keywords

aerospace instrumentation; carbon fibre reinforced composites; cooling; high-temperature electronics; tensile strength; thermal conductivity; thermal management (packaging); C; C-C composites; C-C materials; C-C structures; carbon fiber-carbon matrix composites; carbon-carbon composites; composite density; heat management applications; in-plane thermal conductivity; mechanical strength; pitch-based fiber preforms; tensile strength; thermal conductivity; thermal management; thermal management aerospace applications; thermal management applications; toughness; Aerospace materials; Composite materials; Conducting materials; Fabrics; Heat sinks; Organic materials; Preforms; Temperature; Thermal conductivity; Thermal management;

fLanguage

English

Publisher

ieee

Conference_Titel

High-Temperature Electronic Materials, Devices and Sensors Conference, 1998

Conference_Location

San Diego, CA

Print_ISBN

0-7803-4437-5

Type

conf

DOI

10.1109/HTEMDS.1998.730696

Filename

730696