• DocumentCode
    2347483
  • Title

    A fault-tolerant NoC using combined link sharing and partial fault link utilization scheme

  • Author

    Teh, Ying Fei ; Qian, Zhiliang ; Tsui, Chi-ying

  • Author_Institution
    Dept. of Electron. & Comput. Eng., Hong Kong Univ. of Sci. & Technol., Hong Kong, China
  • fYear
    2011
  • fDate
    3-5 Oct. 2011
  • Firstpage
    296
  • Lastpage
    301
  • Abstract
    With reducing feature size of transistors and increasing number of cores on a single chip, system-on-chips (SoCs) are becoming more vulnerable to faults due to the physical level defects of VLSI fabrication. Fault tolerance and reliability have become two significant challenges for SoC designers. In this work, we propose a novel and efficient scheme to handle the faulty links of a network-on-chip (NoC) by adaptively combining two schemes, namely the link sharing scheme and partial fault link utilization scheme. With our approach, the system is able to optimize the usage of the remaining bandwidth of the links under different fault conditions. Experimental results show a significant improvement in average latency and maximum delay by using the proposed combined scheme with only 4.62% of hardware overhead cost. Our proposed scheme offers a way to increase the effective yield of large and complex NoC systems by enabling the usage of faulty chip with little compromise in the latency performance.
  • Keywords
    VLSI; fault tolerance; network-on-chip; system-on-chip; SoC designers; VLSI fabrication; combined link sharing; fault-tolerant NoC systems; feature feature size reduction; hardware overhead cost; link sharing scheme; network-on-chip systems; partial fault link utilization scheme; physical level defects; reliability; system-on-chips; Bandwidth; Delta modulation; Resource management; Routing; Switches; System-on-a-chip; Transportation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI and System-on-Chip (VLSI-SoC), 2011 IEEE/IFIP 19th International Conference on
  • Conference_Location
    Hong Kong
  • Print_ISBN
    978-1-4577-0171-9
  • Electronic_ISBN
    978-1-4577-0169-6
  • Type

    conf

  • DOI
    10.1109/VLSISoC.2011.6081595
  • Filename
    6081595