DocumentCode :
2347789
Title :
Cycle avoidance in 2D/3D bidirectional graphs using shortest-path dynamic programming network
Author :
Lam, K.P. ; Mak, Terrence S T ; Poon, C.-S.
Author_Institution :
Dept. of Syst. Eng. & Eng. Manage., Chinese Univ. of Hong Kong, Hong Kong, China
fYear :
2011
fDate :
3-5 Oct. 2011
Firstpage :
354
Lastpage :
358
Abstract :
An ordinary-differential-equation (ODE) simulation model has recently been proposed for an N-node dynamic programming (DP) network, which solves the transitive closure and shortest path problems on an architecturally equivalent N-node 2D/3D grid stack. For large-scale randomly generated bidirectional network, where N is large and the inter-grid paths may take either direction, cycles commonly occur leading to a high percentage of nodes with unbound path lengths. The detection of such cycle nodes can be readily found using a shortest-path DP network. In this work we address several issues on the cycle avoidance problem, by first defining the 〈H〉-index and 〈V〉-index and hence its product 〈HV〉 as the two-dimensional turn ability. A regression model was then proposed and obtained empirically to relate the cycle-node ratio, which is the percentage of cycle nodes over N, with 〈HV〉 for several random networks of sizes N = 10×10×2, 10×10×5, 10×10×8. By reducing 〈HV〉 from 0.8 to 0.2, the cycle-node ratio can be reduced from close to 60% to 20% and indicates a significant avoidance of cycle nodes.
Keywords :
differential equations; dynamic programming; graph theory; regression analysis; three-dimensional integrated circuits; 2D/3D bidirectional graphs; 3D IC; ODE simulation model; cycle avoidance problem; cycle-node ratio; ordinary-differential-equation; regression model; shortest path problem; shortest-path DP network; shortest-path dynamic programming network; transitive closure; Dynamic programming; Educational institutions; Indexes; Solid modeling; System recovery; Three dimensional displays; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI and System-on-Chip (VLSI-SoC), 2011 IEEE/IFIP 19th International Conference on
Conference_Location :
Hong Kong
Print_ISBN :
978-1-4577-0171-9
Electronic_ISBN :
978-1-4577-0169-6
Type :
conf
DOI :
10.1109/VLSISoC.2011.6081607
Filename :
6081607
Link To Document :
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