Title :
6B-4 RF Filter using Boundary Acoustic Wave
Author :
Kando, Hajime ; Yamamoto, Daisuke ; Mimura, Masakazu ; Oda, Tetsuya ; Shimizu, Atushi ; Shimoda, Kazunori ; Takata, Eiichi ; Fuyutsume, Toshiyuki ; Kubo, Ryuichi ; Kadota, Michio
Author_Institution :
Murata Manuf. Co., Ltd., Kyoto
Abstract :
Authors report a new structure of a shear horizontal (SH) type boundary acoustic wave for cellular phone applications. Such a structure composed of electrodes with a low shear wave velocity between two materials, namely, the SiO2 film/high density electrode/LiNbO 3 substrate, is proposed. The unique feature of this structure is that it does not require a cavity on the substrate surface. The ladder filter and the longitudinal coupled multiple mode filter composed of this structure is reported. By changing the propagation angle of the acoustic wave, the electromechanical coupling factor k2 ranged from 0 to 16% as well as a normalized bandwidth of 0.67 to 1.85 fold as large as that of a 36~46deg Y-X LiTaO3 leaky surface acoustic wave (LT-LSAW) filter. In addition, an excellent temperature coefficient of delay time (TCD = 25 ppm/degC) and a large mutual coupling coefficient kappa12 (=0.15) were also obtained. The newly developed RF filter using this structure was very small and thin
Keywords :
bulk acoustic wave devices; cellular radio; electromechanical effects; ladder filters; lithium compounds; radiofrequency filters; silicon compounds; LiNbO3; RF filter; SH type boundary acoustic wave structure; SiO2; acoustic wave propagation angle; cellular phone applications; delay time temperature coefficient; electromechanical coupling factor; film-electrode-substrate structure; ladder filter; lithium niobate substrate; longitudinal coupled multiple mode filter; mutual coupling coefficient; shear horizontal BAW structure; shear wave velocity; silica film; Acoustic propagation; Acoustic waves; Bandwidth; Biological materials; Cellular phones; Electrodes; Filters; Radio frequency; Substrates; Surface acoustic waves;
Conference_Titel :
Ultrasonics Symposium, 2006. IEEE
Conference_Location :
Vancouver, BC
Print_ISBN :
1-4244-0201-8
Electronic_ISBN :
1051-0117
DOI :
10.1109/ULTSYM.2006.59