DocumentCode :
2348073
Title :
Thermal Analysis of S Band Transmit Module with Air-Cooling System
Author :
Cholewa, Jacek
Author_Institution :
Telecommun. Res. Inst., Warsaw
fYear :
2007
fDate :
9-12 Sept. 2007
Firstpage :
1970
Lastpage :
1975
Abstract :
The paper describes results of thermal simulations in S band Transmit Module with air cooling system, carried out using FLOTHERM software. Influence of air-cooling system parameters on temperature distribution in module was also investigated. Additionally, results of thermal simulation of High Power Amplifier are presented. These results were compared with photos taken by an infrared camera in order to show correctness of computed results.
Keywords :
air conditioning; power amplifiers; temperature distribution; FLOTHERM software; S band transmit module; air-cooling system; high power amplifier; temperature distribution; thermal analysis; Antenna arrays; Cameras; Computational modeling; Electronic equipment testing; High power amplifiers; Performance analysis; Power system modeling; Power transistors; Temperature; Transmitting antennas; Air-Cooling System; Flotherm; Thermal Analysis; Transmit Module;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
EUROCON, 2007. The International Conference on "Computer as a Tool"
Conference_Location :
Warsaw
Print_ISBN :
978-1-4244-0813-9
Electronic_ISBN :
978-1-4244-0813-9
Type :
conf
DOI :
10.1109/EURCON.2007.4400277
Filename :
4400277
Link To Document :
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