DocumentCode :
2348216
Title :
STT-RAM based energy-efficiency hybrid cache for CMPs
Author :
Li, Jianhua ; Xue, Chun Jason ; Xu, Yinlong
Author_Institution :
Dept. of Comput. Sci. & Technol., Univ. of Sci. & Technol. of China, Hefei, China
fYear :
2011
fDate :
3-5 Oct. 2011
Firstpage :
31
Lastpage :
36
Abstract :
Modern high performance Chip Multiprocessor (CMP) systems rely on large on-chip cache hierarchy. As technology scales down, the leakage power of present SRAM based cache gradually dominates the on-chip power consumption, which can severely jeopardize system performance. The emerging nonvolatile Spin Transfer Torque RAM (STT-RAM) is a promising candidate for large on-chip cache because of the ultra low leakage power. However, the write operations on STT-RAM suffer from considerably higher energy as well as longer latency compared with SRAM which will make STT-RAM in trouble for write-intensive workloads. In this paper, we propose to integrate SRAM with STT-RAM to construct a novel hybrid cache architecture for CMPs. We also propose dedicated microarchitectural mechanisms to make the hybrid cache robust to workloads with different write patterns. Extensive simulation results demonstrate that the proposed hybrid scheme is adaptive to variations of workloads. Overall power consumption is reduced by 37.1% and performance is improved by 23.6% on average compared with SRAM based static NUCA under the same area configuration.
Keywords :
SRAM chips; cache storage; multiprocessing systems; power aware computing; CMP; SRAM; STT-RAM based energy efficiency hybrid cache; high performance chip multiprocessor system; hybrid cache architecture; microarchitectural mechanism; nonvolatile spin transfer torque RAM; on-chip cache hierarchy; on-chip power consumption; ultra low leakage power; Benchmark testing; Computer architecture; Hybrid power systems; Power demand; Radiation detectors; Random access memory; System-on-a-chip; Energy Efficiency; Hybrid Cache; Spin Transfer Torque RAM;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI and System-on-Chip (VLSI-SoC), 2011 IEEE/IFIP 19th International Conference on
Conference_Location :
Hong Kong
Print_ISBN :
978-1-4577-0171-9
Electronic_ISBN :
978-1-4577-0169-6
Type :
conf
DOI :
10.1109/VLSISoC.2011.6081626
Filename :
6081626
Link To Document :
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